Broadcom, Apple Extend Tie-Up to 2031 With New Custom Chips

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Broadcom, Apple Extend Tie-Up to 2031 With New Custom Chips

AI hardwareenterprisesilicon Bloomberg

Broadcom and Apple have extended their chip partnership through 2031, focusing on custom ASICs to support Apple's upcoming AI server infrastructure.

What: Apple and Broadcom signed a multi-year deal to develop custom application-specific integrated circuits (ASICs) through 2031. This silicon is designed to power future AI-related features, with Apple targeting 2027 for the rollout of its advanced AI server architecture.

Why it matters: This deep, long-term supply chain integration signals that Apple intends to control its AI performance layer by vertically integrating custom hardware rather than relying on off-the-shelf components.

Decoder

ASIC: A chip designed for a specific task rather than general-purpose computing, allowing for higher efficiency and performance in specialized applications like AI inference.

Original article

Broadcom and Apple have expanded their partnership through to 2031. The companies are working together to develop application-specific integrated circuit (ASIC) silicon for multiple generations of Apple products. ASIC chips are increasingly vital to the development of components for processing artificial intelligence-related tasks. Apple plans to deploy its advanced AI servers as early as 2027.

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